Film capacitors will melt at high temperatures, and traditional ceramic capacitors, such as Class II X7R capacitors, cannot achieve ideal capacitance values at high voltages. Then an ideal capacitor is needed to meet the high voltage and high temperature resistance requirements of the power electronics industry for components.
In order to improve the efficiency and power density of converters and inverters in circuit boards, manufacturers are experimenting with third semiconductors, such as semiconductor materials such as gallium nitride (GaN) and silicon carbide (SiC), to create metal oxide semiconductor fields Effect transistors (MOSFETs) and other electronic components.
Compared to traditional silicon-based materials, these materials can operate at higher switching frequencies, resulting in higher current and power generation; at the same time, they have higher temperature ratings, so they are suitable for automotive electronics, aerospace, Harsher application environments such as energy production and test equipment.
However, advances in semiconductor technology can have a knock-on effect, affecting critical components in DC bus applications and other power circuit applications. Fast switching of circuits in a small package means that the associated components enter a super high temperature state, which requires passive components in the application (such as DC bus capacitors and snubber capacitors) to operate at temperatures as high as 125°C, Otherwise, engineers will have to design supplemental cooling systems, which will ultimately increase the weight, complexity and cost of the power module.
The industry's past application practice for this has been to use large film capacitors with high current ratings and high reliability, however since they melt at high temperatures. At the same time, traditional MLCC ceramic capacitors, such as Class II X7R capacitors, although they can operate at high temperatures, they can achieve less than ideal capacitance values at high voltages. Then there is a need for alternatives that can meet the high-voltage and high-temperature resistance requirements of the power electronics industry for components.
How are their characteristics compared to conventional capacitors?
In recent years, component manufacturers have introduced two new capacitor technologies, lead lanthanum zirconate titanate (PLZT) and strontium bismuth titanate (SBFT) dielectrics, designed to meet the high voltage and high temperature requirements of the power electronics industry. Reaching this level requires engineers to have an in-depth understanding of the DC bias and AC current versus capacitance and capacitance of bismuth strontium titanate (SBFT), lead lanthanum zirconate titanate (PLZT), and multilayer ceramic capacitors (MLCCs) based on traditional X7R materials. Performance analysis of temperature rise effects.
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